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IC Manufacturing, Package&Test


2025-04-30

[News] Samsung Reportedly Nears 2nm Win with First Qualcomm Phone AP Deal in 3 Years

IC Manufacturing, Package&Test

While Samsung has reportedly been wrestling with 3nm yield issues and the lack of orders from major clients, there may be light at the end of the tunnel. According to Sedaily, the company is now in the final stages of locking in a deal to produce Qualcomm’s Snapdragon 8 Elite 2 using its next-gen ...

2025-04-30

[News] Intel Ramps Up Foundry Race: 14A Risk Production in 2027; 18A Variants Drop in 2026 and 2028

IC Manufacturing, Package&Test

Shortly after TSMC announced plans to mass-produce A14 in 2028, Intel appears ready to compete with an aggressive roadmap for 14A and 18A. According to Intel’s press release, Team Blue is preparing two more 18A variants and has begun sharing early 14A Process Design Kits (PDKs) with lead customers...

2025-04-30

[News] Intel Appointed Tasha Chuang as VP of the Sales and Marketing BU and General Manager of Intel Taiwan

IC Manufacturing, Package&Test

Intel announced the appointment of Tasha Chuang as Vice President of the Sales and Marketing Business unit and General Manager of Intel Taiwan. In her new role, Chuang will lead the Taiwan team to drive Intel’s business and marketing efforts in the local market, empowering global customers, and st...

2025-04-30

[News] How Major Chipmakers Weigh in on Tariff Uncertainty: Key Takeaways from Intel, TI, NXP and STM

IC Manufacturing, Package&Test

Amid tariff uncertainty under Trump, major U.S. and European chipmakers shared their outlooks in recent earnings calls. Some reported no clear shifts in customer behavior, while others outlined plans and potential impact timelines. Here's a quick read on how Intel, TI, NXP, and STMicroelectronics ar...

2025-04-29

[News] Indian Research Team Submits Angstrom-Scale Chip Proposal

IC Manufacturing, Package&Test

It’s reported that a team of 30 scientists from the Indian Institute of Science (IISc) has submitted a proposal to the government to develop Angstrom-scale chips, which will leverage new semiconductor technologies based on two-dimensional (2D) materials. The proposal suggests that using these adva...

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