Backed by founder Ren Zhengfei’s belief that advanced packaging and stacking can keep China in the advanced chip race, Huawei has reportedly filed a patent for a quad-chiplet design—likely linked to its next-gen AI chip, the Ascend 910D, per Tom’s Hardware. The report suggests that it could...

As artificial intelligence (AI) and high-performance computing (HPC) enjoy burgeoning growth, chip power consumption is highly on the rise—making heat dissipation a critical bottleneck limiting performance and reliability. On June 13, U.S.-based Coherent announced the launch of its breakthrough di...

AMD officially unveiled its MI350 series GPUs at the Advancing AI 2025 event on June 12—and its key suppliers are now coming into focus. According to Commercial Times, both the MI350X and MI355X are built on TSMC’s N3P node. On the memory front, Sedaily reports that the chips pack 12-high HBM3E ...

With big techs led by NVIDIA betting on TSMC’s CoWoS, the foundry giant is moving ahead with its CoPoS (Chip-on-Panel-on-Substrate) technology amid strong AI demand. According to MoneyDJ and the Economic Daily News, TSMC’s first CoPoS pilot line is set for 2026, with mass production targeted by ...

According to EETimes China, citing Dutch media outlet de Gelderlander, semiconductor giant NXP is reportedly planning to shut down several 8-inch wafer fabs as it transitions to more efficient 12-inch production. The report states that four 8-inch fabs are slated for closure—one in Nijmegen, the N...