Subject


IC Manufacturing, Package&Test


2025-09-05

[News] TSMC to Implement a Significant Price Hike

IC Manufacturing, Package&Test

As per foreign media reports, Taiwan Semiconductor Manufacturing Company (TSMC) is preparing to implement large-scale price adjustments over the coming years—a move expected to significantly impact chip production costs for major clients like Apple and NVIDIA. The driving forces behind this pricin...

2025-09-05

[News] Huawei’s Bold Return: Mate XTs Debuts Kirin 9020 After Four Years of Chip Silence

IC Manufacturing, Package&Test

As Huawei debuted the second-generation trifold smartphone, the Mate XTs, on September 4, the spotlight turned to the company’s bold return to high-end silicon. According to Huawei Central, mydrivers and The Paper, Huawei Consumer Business Group Chairman Richard Yu officially confirmed at the laun...

2025-09-04

[News] Resonac Teams up with Applied Materials, TEL and Other Chip Giants on Panel-level Interposers

IC Manufacturing, Package&Test

As fan-out panel-level packaging (FOPLP) gains traction among semiconductor leaders like TSMC, Japanese companies—long known for their materials expertise—are stepping into the spotlight as well. Resonac, according to Nikkei and its press release, has announced JOINT3, a joint development fra...

2025-09-04

[News] Samsung Reportedly Plans Exynos 2600 in Galaxy S26 Models, Reducing Qualcomm Reliance

IC Manufacturing, Package&Test

According to South Korea’s Maeil Business Newspaper, sources say Samsung plans to equip the base and slim Galaxy S26 models with the Exynos 2600, while the Ultra version will feature Qualcomm’s Snapdragon 8 Elite Gen 2. Samsung’s Exynos is reportedly showing a rebound in performance, accord...

2025-09-04

[News] China’s Chip Industry Surges in 1H25 — 38 A-Share Listed Firms Reportedly Post Growth

IC Manufacturing, Package&Test

According to Shanghai Securities News, China’s chip industry is reportedly seeing growth driven by AI. The report notes that among 102 A-share listed companies engaged in digital chip design, analog chip design, integrated circuit manufacturing, and IC packaging and testing, 66 posted profits in t...

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