Subject


IC Manufacturing, Package&Test


2022-01-14

Heterogeneous Integration Expected to Become Key Part of Packaging Technology Thanks to Development from EDA Companies

IC Manufacturing, Package&Test

Although current semiconductor process technologies have evolved to the 3nm and 5nm nodes, SoC (system on a chip) architecture has yet to be manufactured at these nodes, as memory and RF front-end chiplets are yet to reach sufficient advancements in transistor gate length and data transmission perfo...

2022-01-05

Fire at ASML’s Berlin Plant May Impact EUV Optical Component Supply, Says TrendForce

IC Manufacturing, Package&Test

A fire occurred at ASML’s factory in Berlin, Germany on January 3, according to TrendForce’s investigations. ASML is the largest supplier of key equipment (including EUV and DUV) required for foundry and memory production. According to TrendForce’s preliminary inquiry, approximately 200m2 out...

2021-12-06

2021 Annual Global Power Management IC Prices Jump 10%, Supply Remains Tight for 1H22, Says TrendForce

IC Manufacturing, Package&Test

Due to material shortages caused by insufficient semiconductor supply, to date, power management IC (PMIC) prices remain on an upward trend, according to TrendForce’s latest investigations. Average selling price (ASP) for 1H22 is forecast to increase by nearly 10%, reaching a record six year high...

2021-09-15

Revenue of Top 10 IC Design (Fabless) Companies Reaches US$29.8 Billion for 2Q21, Though Growth May Potentially Slow in 2H21, Says TrendForce

IC Manufacturing, Package&Test

In view of the ongoing production capacity shortage in the semiconductor industry and the resultant price hike of chips, revenue of the top 10 IC design companies for 2Q21 reached US$29.8 billion, a 60.8% YoY increase, according to TrendForce's latest investigations. In particular, Taiwanese compa...

2021-09-11

Chipbond and UMC will likely strengthen their product R&D and market penetration via strategic partnership

IC Manufacturing, Package&Test

Leading driver IC OSAT company Chipbond and major foundry UMC announced on September 3 that the two companies established a strategic partnership via a stock swap, through which UMC (and its subsidiary UMC Capital) will hold 9.09% of Chipbond’s equity, while Chipbond will hold 0.62% of UMC’s equ...

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