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IC Manufacturing, Package&Test


2023-08-11

[News] Industry Buzz: Major Price Drop in 8-Inch Wafer Foundry Services

IC Manufacturing, Package&Test

According to a report by Taiwan Economic Daily, industry sources have revealed that due to sluggish terminal demand and market competition, TSMC and Vanguard have recently been progressively lowering their prices for 8-inch wafer foundry services, with reductions as high as 30%. While 8-inch wafe...

2023-08-10

[News] TSMC Confirms Kaohsiung Plant Will Adopt 2nm Advanced Process

IC Manufacturing, Package&Test

TSMC previously announced in November 2021 that it plans to establish two wafer fabrication plants for the 7nm and 28nm processes in Kaohsiung, a southern city of Taiwan. Construction was set to begin in 2022, with official production expected to commence in 2024. However, following the announcement...

2023-08-09

TrendForce Analysis: TSMC’s Ambitious ESMC Project Faces Global Labor Challenges and Regulatory Complexities

IC Manufacturing, Package&Test

Leading semiconductor companies TSMC, Robert Bosch GmbH, Infineon, and NXP Semiconductors have jointly to invest in the European Semiconductor Manufacturing Company (ESMC) GmbH, situated in Dresden, Germany. This strategic move aims to bolster the region's semiconductor manufacturing capabilities, p...

2023-08-09

AI GPU Bottleneck Explained: Causes and Prospects for Resolution

IC Manufacturing, Package&Test

Charlie Boyle, Vice President of NVIDIA's DGX Systems, recently addressed the issue of limited GPU production at the company. Boyle clarified that the current GPU shortage is not a result of NVIDIA misjudging demand or constraints in Taiwan Semiconductor Manufacturing Company's (TSMC) wafer produ...

2023-08-08

An In-Depth Explanation of Advanced Packaging Technology: CoWoS

IC Manufacturing, Package&Test

Over the past few decades, semiconductor manufacturing technology has evolved from the 10,000nm process in 1971 to the 3nm process in 2022, driven by the need to increase the number of transistors on chips for enhanced computational performance. However, as applications like artificial intelligence ...

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