Subject


IC Manufacturing, Package&Test


2023-07-18

In Response to AI Market Development, TSMC Kaohsiung Fab Reportedly to Transition to 2nm Node

IC Manufacturing, Package&Test

According to media reports, in response to the booming demand in the artificial intelligence market, TSMC has altered its Kaohsiung factory plan. Originally scheduled for a 28-nanometer mature process, the factory will now be equipped with a 2-nanometer advanced process, with mass production expecte...

2023-07-17

What is the Progress of TSMC, Samsung, and Rapidus in the 2nm Technology Race?

IC Manufacturing, Package&Test

In the continued sluggish consumer electronics market and amidst the booming era of artificial intelligence, semiconductor manufacturers are actively targeting high-performance chips and intensifying the competition over the 2nm process node. TSMC, Samsung, and the newcomer Rapidus are all active...

2023-07-12

Over 20 Wafer Fabs Worldwide to Be Completed Year by Year, Will TSMC Establish a New 7nm Production Line in Japan?

IC Manufacturing, Package&Test

According to sources cited by Nikkan Kogyo Shimbun, TSMC intends to commence the construction of the second fab in Kikuyo-cho, Kumamoto Prefecture, Japan, in April 2024, with the goal of commencing production before the end of 2026. It is worth mentioning that news about TSMC's plan to build its ...

2023-06-07

TSMC Lowers Full-Year Semiconductor Growth Forecast, But Advanced Packaging Demand Outstrips Supply

IC Manufacturing, Package&Test

Semiconductor manufacturing leader TSMC held its annual shareholder meeting on June 6, addressing issues including advanced process development, revenue, and capital expenditure. TSMC's Chairman Mark Liu and President C.C. Wei answered a series of questions. The key points from the industry are summ...

2023-06-06

Disruption in 2.5D/3D Packaging: Hybrid Bonding Rising as New Cornerstone

IC Manufacturing, Package&Test

The surge in AIGC and new technologies such IoT, AI, 5G, AR/VR are driving a huge demand for computational power of high-end chips. This has been even outpacing the performance increase offered by the long-standing Moore's Law, ushering in a "post-Moore" era where revolutions in advanced chip design...

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