According to a report from Taiwan's Commercial Times, NVIDIA is aggressively establishing a non-TSMC CoWoS supply chain. Sources in the supply chain reveal that UMC is proactively expanding silicon interposer capacity, doubling it in advance, and now planning to further increase production by over t...

According to the Korea Economic Daily. Samsung Electronics' HBM3 and packaging services have passed AMD's quality tests. The upcoming Instinct MI300 series AI chips from AMD are planned to incorporate Samsung's HBM3 and packaging services. These chips, which combine central processing units (CPUs), ...

As reported by TechNews, a media partner of TrendForce, Southeast Asia and India, equipped with the advantages of demographic dividends, strategic geographic positioning, manufacturing capabilities, and rapidly growing economic markets, have undoubtedly emerged as the preferred destinations for the ...

In response to the demands of high-performance computing, AI, 5G, and other applications, the shift towards chiplet and the incorporation of HBM memory has become inevitable for advanced chips. As a result, packaging has transitioned from 2D to 2.5D and 3D formats. With chip manufacturing advanci...

According to Taiwan's Economic Daily, the consumer market is experiencing starkly low demand, causing IC design firms primarily relying on mature processes, such as those in driver ICs, power management ICs, CMOS image sensors (CIS), and microcontrollers (MCUs), to adopt a notably cautious approach ...