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IC Manufacturing, Package&Test


2024-05-20

[News] Apple COO Rumored to Make Secret Visit to TSMC, Booking Advanced Capacity for AI In-house Chips

IC Manufacturing, Package&Test

As Apple keeps advancing in AI as well as developing its own in-house processors, industry sources indicated that the tech giant’s Chief Operating Officer (COO) Jeff Williams recently made a visit to TSMC, and was personally received by TSMC’s President, C.C. Wei, according a report by Economic ...

2024-05-20

[News] TSMC Targets to Increase Specialty Capacity by 50% by 2027, with N4e Reportedly its Latest Weapon

IC Manufacturing, Package&Test

In addition to the aggressive overseas expansion plans recently, TSMC also demonstrates its ambition of increasing specialty capacity, targeting to be expanded by 50% by 2027, according to a report by AnandTech. A key driver of this demand will be TSMC’s forthcoming specialty node, N4e, a 4nm-clas...

2024-05-17

[News] TSMC Reportedly Prepares Next-generation HBM4 Manufacturing, Utilizing 12nm and 5nm Process Nodes

IC Manufacturing, Package&Test

TSMC reportedly plans to utilize 12nm and 5nm process nodes in manufacturing the latest HBM4 memory, according to a report by AnandTech. Citing TSMC’s executives, the world’s largest dedicated semiconductor foundry would employ two fabrication processes, N12FFC+ and N5, to integrate HBM4e memory...

2024-05-14

[Insights] Trendforce: Foundry Capacity Market Share of Advanced Process to Decline in Taiwan, Korea until 2027, While US on the Rise

IC Manufacturing, Package&Test

TrendForce’s latest findings revealed that as of 2024, Taiwan is expected to lead the global semiconductor foundry capacity in advanced manufacturing processes (including 16/14nm and more advanced technologies) with a 66% market share, followed by Korea (11%), US (10%), and China (9%). However, th...

2024-05-10

[News] Intel Secures First Batch of High-NA EUV Equipment from ASML, Ahead of Samsung and SK Hynix

IC Manufacturing, Package&Test

Intel has secured its supply of the new High-NA EUV (high-numerical aperture extreme ultraviolet) lithography equipment from ASML, which the semiconductor heavyweight will allegedly use on its 18A (1.8nm) and 14A (1.4nm) nodes, according to reports from TheElec and Wccftech. According to sources ...

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