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IC Manufacturing, Package&Test


2024-09-19

[Insights] China’s MIIT Unveils Latest Domestic DUV Equipment, Faces Challenges for 40nm Processes

IC Manufacturing, Package&Test

On September 9, 2024, China’s Ministry of Industry and Information Technology (MIIT) released the "Guiding Catalog for the Promotion and Application of Major Technical Equipment (2024 Edition)," listing 286 domestically manufactured equipment items. Among these, the KrF and ArF lithography machine...

2024-09-19

[News] TSMC Reportedly Begins Small-Scale Production in Arizona for Apple’s A16 with the N4P Node

IC Manufacturing, Package&Test

In early September, rumors have it that TSMC’s first US fab in Arizona began producing engineering wafers using the 4nm process in April, with yields reportedly comparable to those manufactured in its Southern Taiwan Science Park facility. Now here’s the latest update: the fab has started trial ...

2024-09-18

[News] ByteDance Reportedly Turns to TSMC on in-house AI Chips to Cut Purchase Cost on NVIDIA

IC Manufacturing, Package&Test

ByteDance, the parent company of TikTok, is said to be collaborating with TSMC, eyeing for the mass production of two self-developed AI chips by 2026, according to reports by Economic Daily News and The Information. ByteDance’s AI chips are expected to be made with TSMC’s 5nm node, which woul...

2024-09-18

[News] US and Japan on the Verge of Deal to Restrict Chip Technology Exports to China

IC Manufacturing, Package&Test

According to a recent Financial Times report, the US and Japan are nearing an agreement to restrict tech exports to China’s chip industry, despite Tokyo's concerns over potential retaliation from Beijing. The White House aims to introduce new export controls ahead of the November presidential elec...

2024-09-18

[News] Breakthrough in China’s Domestic DUV Equipment to 8nm? Experts Call It a Misunderstanding

IC Manufacturing, Package&Test

Recent reports of breakthroughs in China's chip manufacturing equipment have gained attention, with rumors suggesting that China’s domestically-made DUV equipment can produce chips at 8nm and below. Some companies have also applied for EUV equipment patents. However, according to a report by the C...

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