Subject


IC Manufacturing, Package&Test


2023-06-07

TSMC Lowers Full-Year Semiconductor Growth Forecast, But Advanced Packaging Demand Outstrips Supply

IC Manufacturing, Package&Test

Semiconductor manufacturing leader TSMC held its annual shareholder meeting on June 6, addressing issues including advanced process development, revenue, and capital expenditure. TSMC's Chairman Mark Liu and President C.C. Wei answered a series of questions. The key points from the industry are summ...

2023-06-06

Disruption in 2.5D/3D Packaging: Hybrid Bonding Rising as New Cornerstone

IC Manufacturing, Package&Test

The surge in AIGC and new technologies such IoT, AI, 5G, AR/VR are driving a huge demand for computational power of high-end chips. This has been even outpacing the performance increase offered by the long-standing Moore's Law, ushering in a "post-Moore" era where revolutions in advanced chip design...

2023-05-18

The Investment Surge: China’s PMIC Industry Revs Up

IC Manufacturing, Package&Test

Under the grand banner of China's domestic substitution policy, the wave of locally produced chips is swiftly spreading to the realm of Power Management ICs (PMICs). Over the past three years, the number of fundraisings for Chinese PMIC manufacturers has shot up. We've seen an increase from 18 ro...

2023-05-11

A Deep Dive into China’s Leading Foundries Amidst US Restrictions

IC Manufacturing, Package&Test

The risks associated with the United States' suppression of China's semiconductor industry and the ongoing tension in China-US relations continue to permeate the supply chain. However, most customers of foundries are adopting a cautious approach, either maintaining a wait-and-see attitude or gradual...

2023-05-09

Samsung Starts the Foundry Battlefield with a Saying of Surpassing TSMC in 5 Years

IC Manufacturing, Package&Test

Samsung recently announced that they will ahead of TSMC in the foundry market within 5 years. At the same time, Intel also claimed to become the second-largest player in the market before 2030. Currently, both Samsung and TSMC are adapting 3nm process to do the chip manufacturing, with the technolog...

  • Page 152
  • 156 page(s)
  • 778 result(s)

Get in touch with us