As semiconductor manufacturing processes evolve more gradually, 3D packaging emerges as an effective means of prolonging Moore's Law and enhancing the computational prowess of ICs. Within the realm of 3D stacking technology, the Interuniversity Microelectronics Centre (imec) based in Belgium categor...

In recent developments, Samsung Foundry, a subsidiary of Samsung Electronics, has disclosed that it has initiated discussions with major chip clients, gearing up to provide services utilizing 1.4nm and 2nm processes. It's been said that Samsung being ahead in the production of 3nm GAA (gate-all-a...

ASE Holdings conducted an earning conference on October 26th to unveil its Q3 financial results and offer insights into future business prospects. All eyes are on ASE's progress in CoWoS advanced packaging. Joseph Tung, the Chief Financial Officer (CFO) of ASE, expressed confidence in AI and ongoing...

On October 17, 2023, the U.S. government unveiled an updated set of regulations for semiconductor exports, introducing stricter standards for advanced AI chips. Additionally, these regulations expand control over the export of exposure equipment and include Chinese GPU design startups on an Entity L...

According to a report by Bloomberg, Yoshihiro Seki, Secretary-General of the ruling Liberal Democratic Party and a member of the Japanese parliament, has announced that the government is planning to allocate an additional ¥900 billion for the construction of TSMC's Fab 2 in Kumamoto, Japan. Further...