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As China’s top memory firms race to advance next-gen DRAM and NAND, domestic chip equipment makers are stepping up for a slice of the booming HBM market as well. According to ijiwei, ACM Research has introduced several solutions optimized for HBM production and plans to release HBM4-compatible cle...
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With major orders secured, Samsung is accelerating preparations for seamless U.S. production. According to Sedaily, the company’s Device Solutions Americas division is hiring veteran engineers for its Customer Engineering (CE) team to resolve complex foundry challenges, stabilize yields, and ensur...
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In recent weeks, China’s semiconductor industry has seen a hike in major capital investment into Integrated Circuit (IC) sector. Shanghai IC Industry Investment Fund Phase II Raises Capital to CNY 24.06 Billion, Up ~66% Corporate registry data shows that the Shanghai Integrated Circuit Indus...
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Amid heightened attention on Intel’s EMIB (Embedded Multi-die Interconnect Bridge), TSMC is experiencing exceptionally strong demand for its own advanced packaging. According to Economic Daily News, a surge of AI and HPC orders from NVIDIA, Google, Amazon, and MediaTek has driven TSMC’s entire C...
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U.S. export controls are hitting global chip-tool makers, and Tokyo Electron (TEL) is scrambling to make up for shrinking orders from China. According to a recent interview with Nikkei, Executive Managing Director for finance Hiroshi Kawamoto says that by fiscal 2026, the company’s equipment for a...