Subject


Consumer Electronics


2025-12-24

[News] Apple Reportedly Sources 60–70% of iPhone 17 LPDDR5X from Samsung, Eyeing iPhone 18 Volumes

With iPhone 17 breaking sales records, Apple CEO Tim Cook offered a rare glimpse into the company’s holiday-quarter outlook at the latest earnings call, stating that Apple expects to achieve a new all-time revenue record in December, as reported by MacRumors. Against this backdrop, Hankyung now su...

2025-12-23

[News] Top PC Maker, Likely HP or Lenovo, Reportedly Locks in Memory Supply following Supplier Visits

As memory prices surge, PC makers are moving to pass costs onto consumers while scrambling to secure chip supply ahead of potentially larger price swings in the market by mid-2026. Yicai Global reports that a top-tier PC company recently made intensive visits to major memory suppliers—including Sa...

2025-12-23

[News] Samsung Reportedly Preps 4:3 “Wide Fold” Phone to Take On Apple, Launch Set for Fall 2026

The foldable smartphone market is heading toward a direct showdown, as Samsung’s rumored foldable device, industry-dubbed the “Wide Fold,” is reportedly being developed in a form factor similar to Apple’s forthcoming foldable iPhone. According to ETNews, sources say the two devices are being...

2025-12-22

[News] Xiaomi 17 Ultra Price Hike Reportedly Confirmed: Memory Crunch Forces Notable Increase

With the Christmas holidays around the corner, Xiaomi has confirmed the Xiaomi 17 Ultra will launch on December 25, Cailian Press reports. But according to Jiemian News, soaring memory prices mean the flagship will come with a notable price increase, with company president Lu Weibing emphasizing it ...

2025-12-18

[News] Apple Reportedly to Bring WMCM Packaging to A20 Series, Boosting iPhone 18 Thermal Efficiency

Apple’s iPhone 18 is already drawing industry attention, with rumors around its chip packaging further raising expectations. According to Wccftech, citing Weibo tipster Fixed Focus Digital, Apple may shift from InFO (Integrated Fan-Out) to WMCM (Wafer-level Multi-Chip Module) packaging for its A20...

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