According to South Korean media outlet Hankyung, citing sources, NVIDIA is working to reinforce its position in the HBM value chain by taking on the design of the “logic die,” a core component of HBM, starting in the second half of 2027, while also planning to diversify where it sources them. ...

According to Nikkei, citing sources, TSMC is removing Chinese chipmaking equipment from its leading-edge 2nm fabs to guard against potential U.S. restrictions that could disrupt production. As the report notes, sources said the decision was influenced by the prospect of a U.S. regulation that would ...

SK hynix announced that it has developed a 321-layer 2Tb QLC NAND flash and has already begun mass production. According to the company’s press release, this is the world’s first QLC device to exceed 300 layers, setting a new milestone in NAND density. The product is scheduled for release in the...

According to Reuters, President Donald Trump announced on Friday that the U.S. will acquire a 10% stake in Intel through a deal that converts government grants into equity. Under the terms of the agreement, the U.S. government will invest $8.9 billion in Intel common stock, as indicated by a press r...

While China gradually relaxes rare earth export restrictions following its late-June agreement—signaling a commitment to approve U.S. export applications—the country today (August 22) announced the “Interim Measures for the Total Volume Regulation and Management of Rare Earth Mining and Rare E...