In early February 2026, competitive dynamics in the global silicon carbide (SiC) industry are coming into sharper focus. Disclosures and earnings call transcripts from companies including Wolfspeed, Infineon Technologies, and STMicroelectronics indicate that while a slowdown in the electric vehicle ...

With the launch of Micron’s semiconductor assembly and test facility in Sanand, Gujarat on February 28, India has formally stepped onto the global memory map. Below are key highlights of the new plant, its role in Micron’s worldwide operations, and why it represents a pivotal milestone in India�...

In the race for next-generation HBM, packaging has emerged as a new focal point. According to ZDNet, industry sources say SK hynix is advancing a packaging overhaul aimed at enhancing stability and performance, with the technology currently under validation. If successfully commercialized, it could ...

As traditional materials approach their physical limits, glass substrates are coming to the forefront of next-generation chip packaging. According to Global Economic, SKC recently announced plans to allocate more than ₩600 billion—over half of its ₩1 trillion capital increase—to its glass su...

As Samsung accelerates fab approvals and equipment installations, questions are emerging about the pace of mass production at the Taylor plant. Korea JoongAng Daily reports that the start of full-scale production at Samsung’s Texas facility is now expected to slip to early 2027. If confirmed, t...