Former TSMC senior vice president Wei-Jen Lo’s move to Intel—along with allegations that he took sub-2nm documents—has now sparked reports that Intel is also trying to recruit TSMC engineers in Arizona. According to Liberty Times, sources say Intel has recently been aggressively poaching engin...

South Korean leaders Samsung and SK hynix dominate the HBM space, but there is one area where their position appears less secure. According to The Elec, a new analysis from the Korea Institute of Intellectual Property Promotion (KIPRO) finds that most key patents for HBM-related advanced packaging ...

Huawei unveiled its new Mate 80 flagship lineup at a launch event on the 25th. According to Commercial Times, citing MyDrivers, the rollout also introduces its next-generation in-house chips — the Kirin 9030 and 9030 Pro. Performance comparisons show that the Kirin 9030 paired with HarmonyOS 6 del...

Japan-backed Rapidus accelerates its 2nm push, outlining bold plans to catch up with top global foundries. Reports from Nikkei and Yomiuri Shimbun say while its first Hokkaido Chitose fab has yet to start mass production, the company aims to break ground on a second facility as early as FY2027, targ...

As of November 2025, the silicon carbide (SiC) market is undergoing a critical phase of value re-evaluation and structural divergence. On the pricing front, low-end bulk SiC materials are experiencing price increase due to runaway costs, while mainstream 6-inch SiC substrates continue to plunge amid...