[News] UMC Reportedly to Raise Prices Selectively in 2H26, with Broader and Potentially Larger Increases in 2027

As market chatter points to a potential up to 15% price hike for TSMC’s 3nm node, Taiwan’s second-largest foundry UMC has also signaled plans for price increases in the second half of the year and beyond. According to Liberty Times and MoneyDJ, citing CFO Chitung Liu at UMC’s shareholder meeting, the company plans selective price increases in 2H26, followed by broader customer negotiations in 2027.

As previously reported by TechNews in April, citing a client notice, UMC plans to implement wafer price adjustments in the second half of 2026. While the exact scope of the increase has not been disclosed, earlier Liberty Times reporting suggested a roughly 10% hike could take effect as soon as July.

Notably, UMC, citing recent raw material price increases and higher expansion costs in Singapore versus Taiwan, said it is using these factors as key drivers for pricing adjustments. Citing Liu, Liberty Times explains that existing long-term contracts will remain unchanged, while price adjustments may apply to new orders, new processes, and newly ramped capacity, reflecting current cost and investment pressures.

Any price increases in 2H26 are expected to be selective and limited in magnitude, the report notes, adding that the company could move toward more comprehensive price negotiations next year, potentially with larger increases

The trend is in line with TSMC’s rumored move. According to Commercial Times, citing supply chain sources, the foundry giant is expected to raise 3nm pricing again in the second half of 2026, with increases of up to 15%, followed by a potential additional 5%–10% hike in 2027.

UMC’s Expansion in Singapore

Meanwhile, UMC is accelerating its Singapore expansion efforts. According to MoneyDJ, the new Singapore fab, which focuses on 22/28nm nodes and selected specialty processes, is planned for an initial monthly capacity of around 12,000 wafers, with potential to scale up to 18,000 wafers. New capacity is expected to ramp gradually in 2026, with mass production likely slipping into 2027, the report suggests.

It is also worth noting, according to MoneyDJ, that technologies such as silicon photonics, advanced nodes, and advanced packaging are being considered as part of UMC’s Singapore expansion roadmap. Central News Agency, citing Liu, highlights that UMC’s interposer capacity will be increased from 3,000 to 6,000 wafers per month to better meet customer demand.

Read more

• [News] UMC Set to Hike Prices in 2H26, Pricing Tied to Mix, Capacity and Long-Term Deals
• [News] SMIC, Hua Hong Reportedly Lift Prices Amid AI-Driven Capacity Shifts; Hua Hong Expects More 12-Inch Hikes in 2026

(Photo credit: UMC)