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Recently, ROHM announced that it will integrate its own R&D and manufacturing expertise in gallium nitride (GaN) power devices with the process technologies of long-term partner TSMC. The company plans to establish a dedicated production system at its Hamamatsu facility by 2027 to meet surging demand from AI servers and other advanced applications.
Following the completion of the technology transfer, ROHM and TSMC will amicably conclude their collaboration in the automotive GaN segment. However, the two companies will continue to deepen cooperation in pursuit of more efficient and compact power system solutions.
TSMC announced in July 2025 that it would gradually withdraw from its GaN foundry business, with the operation scheduled to formally cease on July 31, 2027.
As TSMC accelerates its shift toward technology licensing after exiting its in-house GaN business, the move is expected to inject fresh momentum into cutting-edge applications such as data centers, electric vehicles and humanoid robotics.
Beyond ROHM, GlobalFoundries signed a GaN technology licensing agreement with TSMC in November 2025. Leveraging TSMC’s process platform, GlobalFoundries aims to strengthen its footprint in key power applications spanning data centers, industrial systems and automotive markets, driving semiconductor power technologies into a new era of high efficiency.
On January 28 this year, Vanguard International Semiconductor also announced a technology licensing agreement with TSMC to introduce its 650V high-voltage and 80V low-voltage GaN process technologies. Development is expected to commence in early 2026, with mass production targeted for the first half of 2028.
(Photo credit: ROHM)