[News] SK hynix, Samsung Showcase LPDDR6 at ISSCC as Qualcomm Reportedly Eyes Samsung’s LPDDR6X

While memory titans vie for HBM4 contracts with NVIDIA, another front in the memory race is heating up. According to TechPowerUp, SK hynix and Samsung are preparing to showcase their next-generation LPDDR6 memory at ISSCC 2026 in San Francisco, taking place from February 15–19.

The report notes that the conference will see both companies highlighting their latest memory technologies, with SK hynix pushing 16 Gb LPDDR6 modules at 14.4 Gbps, while Samsung’s LPDDR6 chips are designed for 12.8 Gbps performance.

SK hynix’s LPDDR6 modules, as per the report, is built on the company’s 1c 10 nm DRAM process, marking its 6th generation of 10 nm DRAM. These modules operate at JEDEC’s top LPDDR6 speeds, putting SK hynix near the limits of the current standard, with overclocked LPDDR6X variants expected to follow, the report adds.

On the other hand, Samsung has also upgraded its LPDDR6 lineup since its initial CES 2026 reveal. TechPowerUp notes that the company will now showcase 16 Gb modules running at 12.8 Gbps, a notable boost from the 10.7 Gbps versions announced in early January.

Though built on a 12 nm process, slightly larger than SK hynix’s 10 nm node, Samsung’s LPDDR6 still reports a 21% improvement in energy efficiency over its predecessor, LPDDR5X, according to TechPowerUp.

Next-Gen LPDDR6X Gains Early Interest

Notably, even before LPDDR6 has officially hit the market, Samsung’s next-generation LPDDR6X is reportedly attracting attention from major tech players. According to The Bell, Samsung has provided samples of LPDDR6X to Qualcomm. The memory, a next-gen low-power DRAM, is expected to enter commercial production in the second half of 2027, the report adds.

The move seems to be unusual, which could be attributed to Qualcomm’s tight chip development schedule. Industry observers cited by The Bell suggest that Qualcomm’s request for LPDDR6X samples aligns with its work on next-generation semiconductors for servers and automotive applications. The company plans to deploy LPDDR6X in its AI accelerator, AI250, slated for release in 2027, as per The Bell.

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• [News] SK hynix Debuts 16-Layer 48GB HBM4 at CES 2026, Alongside SOCAMM2 and LPDDR6

(Photo credit: Samsung)