[News] HBM Hybrid Bonder Demand Reportedly Rising in 2H25, as BESI and ASMPT Eye Growth

According to a ZDNet report citing industry sources on the 25th, leading global semiconductor back-end equipment manufacturers are expected to expand their HBM hybrid bonding operations in the second half of 2025.

BESI Expects Rising Hybrid Bonding Orders in H2 2025

On July 24, Dutch equipment maker BESI stated in its Q2 2025 earnings report that it expects a strong third quarter, with an increase in orders for advanced packaging equipment, including hybrid bonding systems.

The company noted that demand for hybrid bonding tools is projected to rise significantly in the second half of 2025—compared to both the first half of the year and the same period in 2024—as customers move forward with technology roadmaps for new advanced logic and HBM4 products planned for 2026 and 2027.

ASMPT Reports Steady Progress on Next-Gen Hybrid Bonders

ASMPT, a subsidiary of ASMI (ASML’s parent company), also reported steady progress in commercializing its second-generation hybrid bonding equipment during its Q2 2025 earnings call on July 23.

The Singapore-based chip equipment maker plans to ship these next-generation systems to HBM customers in the third quarter. According to the report, ASMPT prevoiusly noted that it had received its first order for an HBM hybrid bonder last year, with delivery scheduled for mid-2025.

Memory Makers Accelerate Hybrid Bonding R&D

As ZDNet points out, HBM hybrid bonding remains in the research and development (R&D) stage, with major memory players such as Samsung Electronics, SK hynix, and Micron currently engaged in prototype production.

Citing industry sources on May 7, Chosun Daily reports that both Samsung Electronics and SK hynix are working to apply hybrid bonding to the mass production of next-generation HBM products. Samsung is expected to introduce the technology with HBM4 (sixth-generation HBM) as early as next year, while SK hynix is likely to adopt it for its seventh-generation HBM, known as HBM4E.

According to TrendForce, growing focus on HBM products in the DRAM industry is accelerating interest in advanced packaging technologies such as hybrid bonding. While manufacturers are still evaluating whether to adopt hybrid bonding for HBM4 16-high stack products, they have confirmed plans to implement the technology in the 20-high stack generation of HBM5.

Read more

• [News] Hanmi Reportedly Eyes Hybrid Bonders by 2027, Says TC Bonders Sufficient for HBM4, HBM5
• [News] LG Makes Bold Move in HBM Race with Hybrid Bonders, Reportedly Sets Sights by 2028

(Photo credit: BESI)