Following Hot Chips 2026 in August, Samsung has revealed fresh details on its next-generation HBM and zHBM at SEMICON Taiwan 2026. On Sept. 1, Jangseok Choi, corporate vice president of Memory Product Planning at Samsung Electronics, said the company’s HBM5 is targeting 2× the performance and 20%...

Intel’s latest 14A progress is drawing attention after CFO David Zinsner said the node’s defect density is improving faster than expected. According to a transcript from Investing.com, Zinsner said at Deutsche Bank’s 2026 Technology Conference that 14A defect density was tracking better than I...

As chipmakers accelerate their push toard advanced nodes, ASML highlighted the growing readiness of High-NA EUV for high-volume manufacturing (HVM) at SEMICON Taiwan 2026, which kicked off this week, TechNews reports, citing Greet Storms, ASML’s senior vice president and head of High-NA EUV produc...

South Korea is exporting less DRAM at sharply higher prices as memory supply tightens. According to Seoul Economic Daily, citing Korea International Trade Association data released Aug. 31, exports of DRAM used in AI chips, including HBM and low-power double data rate (LPDDR) memory, fell 13.2% from...

MediaTek announced Monday evening that it plans to issue US$3.9 billion in ECBs, which are scheduled to list on the Singapore Exchange on September 8. NVIDIA, as a strategic investor, will subscribe to 17,500 units worth US$3.5 billion, accounting for nearly 90% of the total offering, Commercial Tim...