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2026-05-25

[News] Samsung Reportedly Begins V9 NAND Cleanroom Build-Out in Xi’an Following V8 Ramp-Up and V6 Phase-Out

Memory giants are focusing on process transitions rather than simply pursuing aggressive capacity expansion, as they accelerate the phase-out of legacy products and shift toward more advanced NAND offerings. According to Sisa Journal, Samsung, after beginning 8th-generation V-NAND (V8) production in...

2026-05-25

[News] Intel Roadmap Leak Hints at NVIDIA GPUs in 2028 Titan Lake-B/BX; Hammer Lake May Revive Hyperthreading

Intel appears to be preparing several upcoming CPU architectures, with recent leaks shedding light on its future roadmap. According to Notebookcheck, citing Moores Law Is Dead, the company is reportedly planning Intel Razer Lake, Nova Lake-AX, Titan Lake, and Hammer Lake architectures spanning sever...

2026-05-25

[News] South Korea–Netherlands Chip Ties May Go Beyond ASML; Silicon Photonics Seen as a Key Opportunity

The next phase of South Korea–Netherlands semiconductor cooperation may extend beyond ASML and into silicon photonics. According to Nikkei, Dutch Ambassador to Seoul Peter van der Vliet said the two countries could collaborate on next-generation chip technologies that use light, rather than electr...

2026-05-25

[News] AMD Zen 7 Reportedly Built on TSMC A14 Node as Powertech’s FOPLP Packaging Said to Be Under Evaluation

With the CEOs of AMD and NVIDIA arriving in Taiwan back-to-back ahead of COMPUTEX in early June, their visits to key supply chain partners for next-generation CPU and GPU programs have drawn close attention. According to Commercial Times, AMD has already begun early preparations for its next-gene...

2026-05-25

[News] Industry Reportedly Eyes Separating HBM From GPUs to Expand Memory Capacity; Optical Links May Be Key

As AI workloads continue to scale, growing demand for memory capacity and bandwidth is pushing current GPU-HBM architectures toward their limits. According to ZDNet, a researcher at a major Korean memory manufacturer said memory and packaging companies are discussing a new approach that places GPUs...

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