[News] SK hynix Unveils Next-Gen Memory Roadmap: Custom HBM, AI-DRAM, AI-NAND with Tech Giants

Shortly after reporting record Q3 profits, SK hynix unveiled an ambitious memory roadmap at its SK AI Summit 2025 on November 3. According to ZDNet and The Chosun Daily, the company highlighted its push into custom memory solutions, including high-bandwidth memory (HBM), AI-optimized DRAM, and next-gen NAND Flash.

To accomplish this goal, ZDNet notes that SK hynix is also deepening partnerships, as it is collaborating with NVIDIA on AI manufacturing advancements, working with TSMC on next-generation HBM base dies, and teaming up with SanDisk to promote international standardization for the emerging High Bandwidth Flash (HBF) market.

Inside SK hynix’s AI-DRAM and AI-NAND Roadmap

Citing SK hynix CEO Kwak No-jung, ZDNet explains in detail the company’s product plans in the future. The report suggests that SK hynix’s new memory portfolio features custom HBM, AI-D (AI DRAM), and AI-N (AI NAND). Among them, custom HBM is reportedly designed to optimize data processing for customer needs by shifting certain functions from existing system semiconductors to HBM base dies.

According to the report, SK hynix is developing a range of AI DRAM solutions. The lineup includes AI-D O (Optimization), a low-power, high-performance DRAM designed to lower total cost of ownership and enhance operational efficiency; AI-D B (Breakthrough), which delivers ultra-high-capacity memory with flexible allocation; and AI-D E (Expansion), aimed at extending memory applications into areas such as robotics, mobility, and industrial automation.

The Chosun Daily, citing Kwak, notes that for DRAM, the company is preparing AI server–optimized memory modules such as SOCAMM and power-efficient LPDDR5.

On the other hand, as per ZDNet, SK hynix’s AI-N initiative targets next-gen storage with three approaches. AI-N P (Performance) focuses on achieving ultra-high-speed performance, while AI-N B (Bandwidth) enhances bandwidth through advanced stacking technologies to overcome the capacity limits of HBM. Meanwhile, AI-N D (Density) aims to deliver ultra-high-capacity solutions that improve cost competitiveness in large-scale AI storage environments, the report adds.

Steps Up Capex for the AI Era

Notably, to meet soaring AI demand, SK Group is stepping up investments in advanced facilities and technologies, as ZDNet reports. The company has already begun outfitting its new M15X fab, dedicated to high-bandwidth HBM mass production, and plans to further boost capacity through the upcoming Yongin semiconductor cluster, scheduled to open in 2027, the report says.

According to ZDNet, at the SK AI Summit 2025 on November 3, Chairman Choi Tae-won underscored the massive scale of the project, noting that once completed, the Yongin cluster will rival the output of 24 M15X fabs running in parallel, marking a major leap in SK hynix’s production capabilities.

As Yonhap reported, with stronger finances and growing demand, SK hynix plans to boost investment in 2026. The company follows a principle of maintaining its CAPEX at around the mid-30% level of sales, based on a three-year moving average, the report suggested.

Read more

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(Photo credit: SK hynix’s X)