[News] TSMC Reportedly Speeds Advanced Packaging Ramp to Three Quarters, Stresses Local Equipment

According to Liberty Times, TSMC Vice President of Advanced Packaging Technology and Service Jun He said demand for the company’s advanced packaging services is booming, with customers pressing closely. In response, TSMC is working to shorten timelines and accelerate capacity. He also stressed that localizing advanced packaging equipment is crucial to achieving this goal, the report highlights.

As noted by Economic Daily News, He pointed out that as customers speed up product launches, TSMC can no longer expand advanced packaging capacity in the step-by-step manner it once did. In some cases, the timeline must be shortened to just one year—or even ramped to peak capacity within three quarters.

TSMC’s Packaging Ramp Underscores Importance of Equipment Localization

Due to this accelerated schedule, the localization of advanced packaging equipment has become even more critical. He explained that with AI driving faster product cycles—reducing the time from design finalization to mass production and packaging from seven quarters to just three—the company must begin building capacity and placing orders with equipment makers during the R&D phase, later adjusting tools as needed. This makes the localization of advanced packaging equipment highly important, as Liberty Times underscores.

Industry sources noted that advanced packaging technologies such as CoWoS are proprietary developments by TSMC. Unlike wafer manufacturing, which largely depends on equipment from major international suppliers, advanced packaging is an area where Taiwanese equipment makers have greater opportunities to participate, Liberty Times indicates.

TSMC Expands 3DFabric Platform With Next-Gen Packaging Roadmap

TSMC is actively expanding its advanced packaging efforts. According to Economic Daily News, citing the company, TSMC has integrated advanced packaging into its 3DFabric platform, combining both front-end and back-end technologies, including TSMC-SoIC, CoWoS, and the InFO family (such as InFO-PoP and InFO-3D).

The company is also planning to introduce CoWoS-L technology with a 5.5× larger reticle size in 2026. In addition, the TSMC-SoW family’s SoW-X is slated for mass production in 2027, delivering computing power 40 times greater than existing CoWoS solutions—equivalent to that of an entire server rack, the report suggests.

Read more

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(Photo credit: TSMC)