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Amid rumors of Google moving away from its HBM3E and NVIDIA’s looming test in June, Samsung looks set to turn the tide with its next-gen HBM. According to Korean Economic Daily and ZDNet, the company is in talks to supply customized HBM4 chips to major AI players, with shipments potentially starting as early as the first half of 2026.
ZDNet suggests that Samsung is working closely with multiple clients on custom HBM4 and HBM4E solutions, which reportedly involve tech giants like NVIDIA, Broadcom, and Google. If the deals go smoothly, sales contribution could start from 2026, the report adds.
According to Kim Jae-joon, EVP of Samsung’s memory business, the company is on track with HBM4 development, with mass production slated for the second half of 2025 and commercial shipments expected in 2026, as per Korean Economic Daily.
HBM3E Set to Gain Traction in Q2
Samsung posted Q1 operating profit of 6.7 trillion won ($4.68 billion), a 1.2% year-on-year increase. However, the Device Solutions (DS) division saw sales rise 8.47% to 25.1 trillion won, but operating profit dropped 42.4% to 1.1 trillion won. Meanwhile, its memory sales dropped 17% quarter-on-quarter to 19.1 trillion won.
According to ZDNet, Samsung’s HBM sales took a hit due to weaker demand for high-value chips and U.S. export restrictions that curbed shipments to China. On top of that, the transition to the new HBM3E 12-speed version created a temporary demand gap, the report adds.
However, as per the Korean Economic Daily, Samsung claims it has delivered upgraded HBM3E samples to key customers and expects more buyers to come onboard starting in Q2.
Samsung pointed out that it will keep investing as needed to meet the demand for both HBM4 and HBM4E, according to the reports.
A previous report from Commercial Times indicated that Samsung is said to be discontinuing its HBM2E products, implying its shift to more high-end products like HBM3E and HBM4.
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(Photo credit: Samsung)
