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2026 Global AI Packaging: CoWoS vs EMIB Analysis

Last Modified

2025-11-03

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Aperiodically

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PDF

AI-driven demand push chiplet-based packaging; EMIB costs less than CoWoS, signaling a move to modular, efficient interconnects.

Key Highlights

Chiplet/2.5D/3D packaging trend; EMIB vs CoWoS cost and yield advantages.
AI/HPC demand fuels advanced packaging and supply-chain restructuring.
CSPs building in-house ASICs; Google TPU, Meta MTIA indicate new opportunities for advanced packaging.

Table of Contents

Introduction
- 1Q25-4Q26 Major 2.5D Packaging Suppliers' Capacity
TSMC with Its CoWoS Has an Initial Lead in Package Market, but Intel’s EMIB Could Make Inroads Due to Its Advantages in Package Area and Cost
- Distribution of TSMC's CoWoS Production Capacity by Type, 1Q25-4Q26
- Schematics of Intel's EMIB and TSMC's CoWoS
- Comparison of Intel EMIB and TSMC CoWoS

<Total Pages: 7>

1Q25-4Q26 Major 2.5D Packaging Suppliers’ Capacity

Sector: Wafer Fabrication / Foundry IC Testing & Packaging Semiconductors

Tag: CoWoS AI Chip EMIB Chiplet Google TPU MTIA Advanced Packaging Competitive Landscape CSP Market Share Production Capacity Supply Chain TSMC Intel

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