While China’s progress in high-end chipmaking equipment, such as SiCarrier and AMIES’ DUV systems, draws attention, the country is also advancing in key semiconductor materials. Notably, domestic leader Xiamen Hengkun New Material, a top photoresist manufacturer, went public on the Shanghai STAR...

With HBM turning into a scarce resource in the AI boom and imports effectively off-limits, China is racing to develop its own supply, with major tech firms joining the push. Reuters reports that Yangtze Memory Technologies Co. (YMTC), the country’s leading NAND maker, is gearing up to enter the DR...

As China accelerates its memory ambitions with DDR5 capacity reportedly on the rise, domestic NAND powerhouse YMTC has made another bold move. According to Star Market Daily, Changcun Phase III (Wuhan) Integrated Circuit Co., Ltd. was officially established on September 5, with Chen Nanxiang, YMTC�...

As memory giants accelerate development in HBM4 and high-layer NAND, hybrid bonding technology is drawing heightened attention. South Korean leaders Samsung Electronics and SK hynix remain behind in key patents, according to a report from ZDNet. The report highlights that Samsung and SK hynix have d...

YMTC, known for its hybrid bonding patent deal with Samsung and its push toward 294-layer NAND production, has quietly revealed mounting losses. Financial disclosures tied to an investment by Hebei Yangyuan Zhihui Beverage Co showed that YMTC posted an 84 million yuan (about US$11.6 million) loss in...