According to a report by the Korean media outlet The Chosun Daily on June 16th, Samsung's "Galaxy Tab S10" series tablets will be equipped with MediaTek's Dimensity 9300+ application processor (AP) from Taiwan, marking the first instance of MediaTek's AP being adopted by Samsung's flagship tablet. ...

In 2023, Samsung disclosed plans to launch its advanced three-dimensional (3D) chip packaging technology, which would be able to integrate memory and processors needed for high-performance chips, in much smaller sizes. Now, at the Samsung Foundry Forum in San Jose taken place in June, the tech giant...

Taiwan's semiconductor giant, TSMC, faces overwhelming demand for its 3nm technology, with major clients like Apple and NVIDIA fully allocate its production capacity. According to a report from Commercial Times, orders are expected to be filled through 2026. Reportedly, TSMC is planning to raise ...

With the United States expected to further restrict China from acquiring advanced GAA (Gate-All-Around) chip architecture capabilities, coupled with reports of poor yield rates in Samsung's 3nm GAA generation, the semiconductor industry sources cited in a report from Commercial Times state that TSMC...

With high demand for AI chips from major players like NVIDIA and AMD, the capacity for advanced packaging falls short of meeting demand. Industry sources cited in a report from the Economic Daily News indicate that TSMC's new CoWoS facility in the Southern Taiwan Science Park in Chiayi is now underg...