Jun He, Vice President of Advanced Packaging Technology and Service at TSMC, stated that 3D IC is a crucial method for integrating AI chip memory with logic chips. According to a report from TechNews, regarding the development of 2.5D CoWoS advanced packaging, which integrates eight chiplets, T...

With advanced packaging capacity at TSMC being tight, the expansion of CoWoS has garnered significant attention. According to a report from Economic Daily News, Jun He, Vice President of Advanced Packaging Technology and Service at TSMC, noted at SEMICON Taiwan 2024 that the foundry giant is rapidl...

Disappointing financial results. A 15% layoff of its workforce. Restructuring and cost-reduction plans which may include the sale of FPGA unit Altera and freezing its USD 32 billion German fab project. Now, there seems to be more bad news on the way for Intel, as its advanced nodes, specifically 18A...

Intel and Japan's National Institute of Advanced Industrial Science and Technology (AIST), under the Ministry of Economy, Trade and Industry, are reportedly planning to set up an R&D hub in Japan. As per a report from Tom's Hardware, the new facility is expected to be built within the next 3-...

TSMC, along with research teams like imec, continues to push the boundaries in pursuit of optimal solutions for achieving high bandwidth and low power consumption on the same chip area. As per a report from Commercial Times, Imec has even mapped out a blueprint for the Angstrom era, with the pote...