The U.S. government’s efforts to boost domestic semiconductor manufacturing continue to gain momentum. According to a report from TechNews, information submitted by TSMC to the U.S. Department of Commerce reveals that the 2nm process is expected to begin production in the U.S. as early as 2028. ...

According to a report from TechNews, citing Tom’s Hardware, at its European Open Innovation Platform (OIP) Forum, TSMC announced that its ultra-large chip-on-wafer-on-substrate (CoWoS) packaging technology would be certified by 2027, featuring 9x reticle sizes and supporting up to 12 stacks of HBM...

As Trump threatens to impose new tariffs on countries like Mexico, Canada and China, the storm is gradually impacting upstream players in the semiconductor industry. According to Commercial Times, Taiwan’s electronic manufacturing services (EMS) industry begins to feel headwinds, as ASIC companies...

According to Economic Daily News, TSMC’s new 2nm fab in Kaohsiung marked a significant milestone today with its equipment installation ceremony, achieving three notable records. First, it represents TSMC's inaugural 12-inch fab in Kaohsiung, preparing for mass production in 2025. Second, the equip...

According to a report from TechNews, citing Tom’s Hardware, at its European Open Innovation Platform (OIP) Ecosystem Forum, TSMC announced that it is on track to begin mass production of the first chips using its A16 (1.6nm-class) process technology by the end of 2026. The report notes that the...