With its N2 (2nm-class) node beginning mass production in the latter half of 2025, TSMC revealed more details about it at the IEEE International Electron Device Meeting (IEDM) a couple of days ago. According to IEEE Spectrum and Tom’s Hardware, TSMC's new 2nm technology delivers up to 15% faster p...

According to a report by Economic Daily News, TSMC is riding the wave of AI and high-performance computing (HPC) applications, with its USD-denominated revenue expected to reach record highs in Q4 2024 and throughout the year. Recently, rush orders have surged as customers anticipate tighter U.S. re...

According to a report from Commercial Times, TSMC is actively expanding its advanced packaging facilities in Taiwan. With the Tainan facility (AP8) it acquired earlier from Innolux starting small-scale production by the end of 2025, TSMC's CoWoS capacity is expected to triple, rising to 90,000 wafe...

The rapid development of AI, HPC, and other technologies is driving higher demands for semiconductor performance and energy efficiency. Traditional packaging technologies struggle to meet the needs of the AI era, creating an opportunity for advanced semiconductor packaging technologies to shine. ...

Commercial Times, citing a report from The Information, indicated that Apple is currently collaborating with Broadcom to develop its first server chip specifically designed for artificial intelligence (AI) computing, hoping to reduce its reliance on Nvidia. Reportedly, the chip will use TSMC's N3P p...