NVIDIA’s GB200 thermal challenges have made Co-Packaged Optics (CPO) technology a key topic in the tech industry. According to Commercial Times, NVIDIA plans to unveil a new CPO-based switch at the March GPU Technology Conference (GTC), with mass production slated for August. Suppliers like TSMC a...

Ahead of TSMC’s earnings call on January 16th, market rumors have been circulating that the foundry giant’s largest clients are slashing their CoWoS-S orders. According to Commercial Times, AMD and Broadcom are reportedly releasing the CoWoS-S capacity they previously booked due to slowing deman...

According to a report from MoneyDJ, citing Nikkei, global leading semiconductor companies have reduced their investment due to weak demand and overcapacity in semiconductors for electric vehicles (EVs) and smartphones despite the robust demand for AI-related semiconductors. Notably, this marks the...

A couple of days ago, U.S. Commerce Secretary Raimondo stated that TSMC has started the production of advanced 4nm chips in Arizona, as per Reuters. Now the information seems to get confirmed, as a latest Nikkei report notes that Apple is nearing the final stages of verifying its first "made in Amer...

Ahead of TSMC’s earnings call on January 16th, the foundry giant’s capacity expansion plans remains a key focus, as the market is curious about its progress of Arizona plant and its CoWoS (Chip on Wafer on Substrate) output. Notably, the company has reportedly seen positive progress in both a...