Subject


TSMC


2024-03-18

[News] The Era of Heterogeneous Integration Approaches: Who Shall Dominate the Advanced Packaging Field?

"It is not the shortage of AI chips, it is the shortage of our CoWoS capacity," replied TSMC Chairman Mark Liu during an interview in September last year, propelling this technology that TSMC had quietly cultivated for over a decade into a global spotlight. As per a report from TechNews, the hard...

2024-03-13

[News] Apple Reportedly Begins Development of M4 Chip and May Utilize TSMC’s 2nm Process

Shortly after the release of the MacBook Air with the built-in M3 chip, a report from MacRumors has cited the report that Apple is already working on the development of the next-generation M4 chip, expected to be launched next year. As per Mark Gurman revealed in a Q&A with Bloomberg, Apple h...

2024-03-13

[News] TSMC Reportedly Sensing Increased Orders Again, CoWoS Production Capacity Surges

With AI demand exploding across the board, TSMC initiated a major expansion plan for CoWoS in 2023. According to MoneyDJ citing sources, TSMC reportedly initiated a new wave of orders to Taiwan-based equipment manufacturers this month. Delivery is expected in the fourth quarter of this year. Ther...

2024-03-12

[News] PSMC’s Frank Huang Explores Global Expansion through Fab IP, Diverging from TSMC’s Path

As various governments actively court semiconductor foundries in Taiwan, PSMC, in partnership with India's Tata Group, held a groundbreaking ceremony for India's first 12-inch fab on March 12th. As per a report from TechNews, PSMC has been collaborating with Japan and India recently to establish a s...

2024-03-12

[News] The Imminent Arrival of 2-Nanometer Advanced Process

Recently, IC design company Marvell announced an expansion of its long-term partnership with TSMC to include 2-nanometer technology. They will collaborate on developing the industry's first 2-nanometer semiconductor production platform optimized for accelerating infrastructure. Currently, the...

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