Micron Discusses HBM and Advanced Packaging in the AI Era Recently, Yulin Chang, Vice President of Advanced Packaging and Testing Operations at Micron Taiwan, outlined the development of HBM and advanced packaging in the AI era. Chang noted that in the past, GPU was connected to GDDR6 via PCB. To...

As major CSPs ramp up AI infrastructure and shift toward high-performance inference, demand for high-capacity storage keeps climbing—putting next-gen NAND development in the spotlight. Yet, according to ZDNet, Samsung Electronics is struggling to commercialize its ninth-generation (V9) high-capaci...

According to South Korean outlet Yonhap Infomax, shares of Japan’s NAND flash producer Kioxia have been rising sharply amid a supply shortage in the NAND market. The report notes that SK hynix — which invested KRW 3.9 trillion in Kioxia in 2018 — is now realizing significant valuation gains af...

While Micron reportedly passed NVIDIA’s verification and became the first of the big three memory makers to ship SOCAMM (Small Outline Compression Attached Memory Module), the U.S. AI chip giant may revise its adoption plan for this new low-power DRAM (LPDDR) server memory module—a move that cou...

SK hynix announced today that it has completed the development of HBM4 and finalized preparations for mass production—the first company in the world to do so. According to its press release, the company is now ready to deliver top-tier HBM4 to customers in line with their timelines. In its pres...