As Samsung reportedly cleared NVIDIA’s qualification for its 12-layer HBM3E and races to catch up with other memory giants, SK hynix has fired up a pilot production line at its M15X facility in Cheongju, featuring 1b DRAM to meet growing HBM demand, according to The Bell. The company plans to m...

Micron Discusses HBM and Advanced Packaging in the AI Era Recently, Yulin Chang, Vice President of Advanced Packaging and Testing Operations at Micron Taiwan, outlined the development of HBM and advanced packaging in the AI era. Chang noted that in the past, GPU was connected to GDDR6 via PCB. To...

As major CSPs ramp up AI infrastructure and shift toward high-performance inference, demand for high-capacity storage keeps climbing—putting next-gen NAND development in the spotlight. Yet, according to ZDNet, Samsung Electronics is struggling to commercialize its ninth-generation (V9) high-capaci...

According to South Korean outlet Yonhap Infomax, shares of Japan’s NAND flash producer Kioxia have been rising sharply amid a supply shortage in the NAND market. The report notes that SK hynix — which invested KRW 3.9 trillion in Kioxia in 2018 — is now realizing significant valuation gains af...

While Micron reportedly passed NVIDIA’s verification and became the first of the big three memory makers to ship SOCAMM (Small Outline Compression Attached Memory Module), the U.S. AI chip giant may revise its adoption plan for this new low-power DRAM (LPDDR) server memory module—a move that cou...