While performance drop caused by heat has become not only an issue for AI data centers but for smartphones as well, SK hynix announced that it has begun supplying mobile DRAM with industry-first High-K Epoxy Molding Compound, offering highly efficient heat dissipation. According to its press rel...

According to South Korean media outlet Hankyung, citing sources, NVIDIA is working to reinforce its position in the HBM value chain by taking on the design of the “logic die,” a core component of HBM, starting in the second half of 2027, while also planning to diversify where it sources them. ...

SK hynix announced that it has developed a 321-layer 2Tb QLC NAND flash and has already begun mass production. According to the company’s press release, this is the world’s first QLC device to exceed 300 layers, setting a new milestone in NAND density. The product is scheduled for release in the...

According to Sedaily, industry sources on the 20th said the HBM4 samples Samsung supplied to NVIDIA last month have passed initial prototype and quality testing and are set to enter the “pre-production (PP)” stage by the end of this month. If they clear this final validation step, mass productio...

As a key supplier of HBM3 and HBM3e to NVIDIA and a major beneficiary of the AI boom, SK hynix showcases its strong industry position in its freshly released 2025 semi-annual report, highlighting the close partnership with the U.S. chip giant. According to Yonhap News, the company reportedly earned ...