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2026-08-18
[News] Glass Substrate War Heats up: Shinko Electric Advances 22-Layer Product; Samsung Reportedly Faces Ramp-Up Uncertainty
The glass substrate race is heating up as AI chips demand larger packages, with South Korean and Japanese players racing to gain an early edge. According to Seoul Economic Daily, Japan’s Shinko Electric Industries has developed a 22-layer glass substrate by stacking 11 copper wiring layers on each...
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