As memory giants ramp up HBM production at full throttle, they are eager to find strong allies in the supply chain. Fujifilm Holdings, a Japanese semiconductor materials supplier, is said to build a new facility in South Korea to meet the booming demand from local memory chipmakers, including SK hyn...

The rapid development of AI, HPC, and other technologies is driving higher demands for semiconductor performance and energy efficiency. Traditional packaging technologies struggle to meet the needs of the AI era, creating an opportunity for advanced semiconductor packaging technologies to shine. ...

Korean memory giant Samsung has been working hard to prepare for supplying HBM3E to NVIDIA, but now it appears almost impossible to supply to NVIDIA in 2024. According to Wccftech's report, Samsung failed to secure a position in NVIDIA's supply chain because it couldn't meet NVIDIA's qualification t...

Marvell announces new custom HBM compute architecture that enables XPUs to achieve greater compute and memory density. According to its press release, this new AI accelerator (XPU) architecture enables up to 25% more compute, 33% greater memory while improving power efficiency. Notably, the new c...

Following the footsteps of semiconductor bellwethers TSMC and Intel, U.S. head-quartered Micron becomes the first memory giant to secure the funding under the CHIPS Act. According to U.S. Department of Commerce, it has finalized a USD 6.165 billion government subsidy for Micron to support semiconduc...