As memory giants gear up for the next-gen HBM battle, JEDEC has officially released the JESD270-4 HBM4 standard in mid-April. With AI models and HPC workloads demanding faster, larger memory, HBM4 is arriving just right on time. As per JEDEC’s press release, one of the major improvements in HBM...

With 1y and 1z nm 8Gb DDR4 production reportedly winding down, Samsung is said to be discontinuing its HBM2E products as well, as Commercial Times reveals they’ve reached the Last Buy Order (LBO) stage. Though Samsung declined to confirm the information, this could imply its shift to more high-...

According to Commercial Times, after reports that Samsung will halt 1y and 1z nm 8GB DDR4 production starting in April, Micron has also informed customers it will discontinue legacy DDR4 modules for servers. This shift reflects a broader industry trend, as memory makers accelerate product transiti...

Samsung has denied rumors that its Taylor plant timeline will be pushed to 2027, but concerns are growing over the mounting hurdles in its U.S. investment. According to the Chosun Daily, the company has been reluctant to bring in key equipment like EUV machines to the Taylor facility — a move that...

As the HBM race heats up among memory giants, TC (thermal compression) bonders are taking center stage. Notably, recent developments involving key player Hanmi Semiconductor, Micron, and SK hynix have sparked attention—and could potentially reshape the memory landscape, according to reports from T...