Recently, U.S.-based memory giant Micron Technology announced the groundbreaking of a new HBM (High Bandwidth Memory) advanced packaging facility in Singapore. This facility will be the first of its kind in Singapore and is scheduled to begin operations in 2026. Starting in 2027, Micron’s advan...

According to a report from MoneyDJ, citing Nikkei, global leading semiconductor companies have reduced their investment due to weak demand and overcapacity in semiconductors for electric vehicles (EVs) and smartphones despite the robust demand for AI-related semiconductors. Notably, this marks the...

Is U.S. chip giant NVIDIA planning to launch the Rubin lineup early? The speculation now seems to turn into reality. As per South Korean media outlet New Daily, following SK hynix’s footsteps, Samsung is also accelerating the development of HBM4, as it targets to complete the Production Readiness ...

According to Chosun Biz, Samsung Electronics has reportedly decided to cut NAND flash production at its Xi’an plant in China, its largest manufacturing base for the memory chips. The move appears to be a strategic effort to protect profitability as a global NAND oversupply persists, leading to a p...

Foundry giants, as well as ambitious newcomers, have been making strides in capacity expansion as soon as 2025 kicks start. According to SEMI, the semiconductor industry is set to begin 18 new fab construction projects in 2025. Notably, this trend seems to be most evident in advanced nodes. SEMI ...