Subject


Samsung


2025-06-25

[News] Samsung Pushes for 2nm Breakthrough as Industry Bets on TSMC’s 3nm FinFET

Market speculation is mounting that Samsung is aggressively shifting resources toward 2nm development, with plans to debut the next-generation process as early as next year at its Texas fab—potentially aiming to leapfrog TSMC. However, citing sources within the semiconductor industry, Commercial T...

2025-06-24

[News] Samsung Reportedly Resumes Cleanroom Work at Taylor in Q2; 2nm Tool Move-In Targeted for 2026

Samsung is reportedly stepping up preparations for production at its U.S. foundry. According to South Korean outlet ZDNet, citing sources from June 23, the company is discussing plans to begin installing equipment for its 2nm process at the Taylor fab in 2026. The report notes that after several...

2025-06-23

[News] If US Revokes Chip Tool Exemptions: Unpacking TSMC, Samsung, and SK hynix’s China Operations

The U.S. Commerce Department is mulling to revoke licenses previously granted to major chipmakers like TSMC, Samsung, and SK hynix—a move that could create fresh obstacles for their operations in China, according to Reuters. Citing the Wall Street Journal, Wccftech points out that Jeffrey Kessl...

2025-06-20

[News] SK hynix Reportedly Leads Custom HBM4E Push with NVIDIA, Microsoft; Samsung Trails with HBM4

As Samsung pushes to accelerate 1c DRAM development and regain ground in the HBM4 race, current leader SK hynix is pulling ahead with custom HBM solutions for tech giants. According to the Korea Economic Daily, its first customized HBM—likely HBM4E—is set to debut in the second half of 2026. ...

2025-06-20

[News] Samsung’s 1c DRAM Yields Reportedly Reach up to 70%, Paving Way for HBM4 by Year-end

With hopes of turning the tide in the HBM4 era resting on its progress in 1c DRAM, Samsung has reportedly made a major leap in yield rates. According to Sedaily, the company recently achieved yields of 50–70% in tests for its sixth-generation 10nm-class DRAM (1c DRAM) wafers—a jump from the sub-...

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