Samsung Electronics, struggling with HBM3E verification for NVIDIA, reported a drop in its global DRAM market share in its semi-annual report released on Aug. 14, according to South Korean media outlets Sedaily and The Hankyoreh. The company’s DRAM share by value reportedly fell to 32.7% in H1 202...

According to The Korea Economic Daily, sources indicate that Samsung Electronics will invest 25 billion yen (about $170 million) to establish an advanced chip packaging research and development center in Yokohama, Japan. The report adds that the City of Yokohama, which announced Samsung’s R&D ...

According to ZDNet, Samsung Electronics is developing System-on-Panel (SoP), an advanced semiconductor packaging technology. The report notes that if SoP advances quickly, Samsung could secure a role in Tesla’s next-generation Dojo packaging supply chain. At present, Tesla plans to have its “AI6...

According to SEDaily, citing industry sources, Samsung’s investment in the Taylor plant could exceed USD 50 billion. The report says the company is reportedly considering reinstating a KRW 10 trillion (approximately USD 7.7 billion) packaging facility project that was excluded from its U.S. invest...

According to Chosun Biz, utilization rates at Samsung Electronics’ mature node production lines—previously a drag on its foundry business—are reportedly now recovering. The report adds that the ramp-up in mature node production may help ease the company’s annual operating losses. As cited...