Ahead of AMD’s October launch of Instinct MI325X, the U.S. chip giant is said to have several issues with its laptop OEMs, which results in poor execution, a report by Tom’s Hardware notes. Citing remarks from analysts, the report describes the two parties’ relation now as a “Cold War ice ag...

Amid crisis and various rumors, Intel might be finding a buyer for parts of its chip business? Citing sources familiar with the matter, the latest report by Reuters suggests that U.S. chip giant Qualcomm, which is known for its Snapdragon processors used in smartphones, has investigated the possibil...

Recently, Samsung Electro-Mechanics announced that by 2026, the sales share of its high-end Flip Chip Ball Grid Array (FCBGA) substrates for server and artificial intelligence will exceed 50%. FCBGA is an integrated circuit (IC) packaging technology，which involves flipping the chip and connecti...

Per a report by the Vietnam News Agency, Vietnamese Prime Minister Phạm Minh Chính recently signed Government Decree No. 791/QĐ-TTg on the establishment of the National Steering Committee for Semiconductor Industry Development. The main tasks and functions of the steering committee include as...

According to a report from The Chosun Daily, major tech companies like NVIDIA are considering using Intel's foundry services (IFS) as an alternative due to TSMC's packaging capacity shortages. While packaging is a core competency for semiconductor foundries, Samsung, which is facing difficulties in ...