While upstream memory makers continue to lift prices as supply tightens and demand surges, the impact is now cascading into the testing and packaging segment. According to the Economic Daily News, major Taiwanese memory OSAT providers — led by Micron’s key partner Powertech Technology — have r...

As semiconductor heavyweights spearheaded by TSMC accelerate panel-level fan-out packaging (FOPLP) development to revolutionize chip packaging efficiency, the technology is gaining significant traction. According to Commercial Times, supply chain sources reveal that FOPLP production equipment has be...

ACM Research, Inc., a provider of wafer processing solutions for semiconductor and advanced wafer-level packaging applications in China, announced on September 3rd the release of its Ultra C bev-p panel bevel etching tool for fan-out panel-level packaging (FOPLP) applications. This new tool is de...