With the CEOs of AMD and NVIDIA arriving in Taiwan back-to-back ahead of COMPUTEX in early June, their visits to key supply chain partners for next-generation CPU and GPU programs have drawn close attention. According to Commercial Times, AMD has already begun early preparations for its next-gene...

While upstream memory makers continue to lift prices as supply tightens and demand surges, the impact is now cascading into the testing and packaging segment. According to the Economic Daily News, major Taiwanese memory OSAT providers — led by Micron’s key partner Powertech Technology — have r...

As semiconductor heavyweights spearheaded by TSMC accelerate panel-level fan-out packaging (FOPLP) development to revolutionize chip packaging efficiency, the technology is gaining significant traction. According to Commercial Times, supply chain sources reveal that FOPLP production equipment has be...

ACM Research, Inc., a provider of wafer processing solutions for semiconductor and advanced wafer-level packaging applications in China, announced on September 3rd the release of its Ultra C bev-p panel bevel etching tool for fan-out panel-level packaging (FOPLP) applications. This new tool is de...