As demand grows for glass substrates driven by their superior heat resistance and lower warpage in advanced semiconductor packaging, equipment and materials suppliers are accelerating development efforts. Against this backdrop, Japan’s Nikon showcased its light-responsive surface treatment agent �...

While Nikon has lost ground in lithography competition with ASML, the Japanese equipment maker is stepping up efforts to diversify into emerging opportunities. According to a company press release, Nikon is targeting the panel-level packaging market through a new high-productivity digital lithograph...

Shortly after announcing its plan to close the Yokohama Plant, Nikon seems to double down its efforts on advanced node related chipmaking tools. According to Nikkan Shimbun, the Japanese semiconductor equipment firm aims to double sales of its wafer alignment stations—which measure wafer distortio...

On August 21, Nikon announced plans to shut down its Yokohama Plant on September 30. According to Nikkei, the facility employed about 350 people as of the end of July. These employees will remain with the company, relocating to receiving sites as the plant’s operations are transferred to Nikon’s...

As semiconductor giants embrace fan-out panel-level packaging (FOPLP) for larger, more efficient chip designs, Japan’s Nikon is joining the race. The company has begun taking orders in July for its new DSP-100 digital lithography system, designed specifically for 600 mm square panels used in advan...