On September 12, Japan’s Ministry of Economy, Trade and Industry (METI) announced a subsidy of up to JPY 536 billion for Micron’s DRAM plant in Hiroshima. The funding will support new plant construction, production, and R&D, with a particular focus on high-bandwidth memory (HBM) and extreme ...

Micron Discusses HBM and Advanced Packaging in the AI Era Recently, Yulin Chang, Vice President of Advanced Packaging and Testing Operations at Micron Taiwan, outlined the development of HBM and advanced packaging in the AI era. Chang noted that in the past, GPU was connected to GDDR6 via PCB. To...

Following SanDisk’s 10% NAND price hike and Micron’s week-long pricing freeze, Western Digital has become the third company to act, notifying customers that it will gradually raise prices on all HDD products effective immediately, according to industry sources. According to the notice spotted...

While Micron reportedly passed NVIDIA’s verification and became the first of the big three memory makers to ship SOCAMM (Small Outline Compression Attached Memory Module), the U.S. AI chip giant may revise its adoption plan for this new low-power DRAM (LPDDR) server memory module—a move that cou...

As global data center deployments accelerate, cloud giants are shifting their demand from training AI to inference AI, driving sustained growth in high-capacity memory requirements and causing memory supply constraints to migrate from DRAM to NAND. Supply chain sources reveal that following SanDisk'...