After ending production cuts amidst a recovery in the memory industry, Kioxia disclosed its plans on the 3D NAND roadmap last week. According to reports from PC Watch and Blocks & Files, Kioxia stated that achieving a 1,000-layer level by 2027 would be possible. According to the reports, the ...

AI applications is driving the memory market forward, with HBM (High Bandwidth Memory) undoubtedly being a sought-after product of the industry, attracting increased capital expenditure and production expansion from memory manufacturers. At the meantime, a new force in the memory market has quietly ...

According to TrendForce's latest memory spot price trend report, the spot price of DRAM remains weak, as Samsung’s reallocation of its D1A process to the manufacturing of HBM products did little help. As for NAND flash, overall transactions are also sitting on the enervated end due to weakening m...

Driven by memory giants ramping up high-bandwidth memory (HBM) production, according to a report from Korean media outlet TheElec, ASMPT, a back-end equipment maker, has supplied a demo thermal compression (TC) bonder for Micron's HBM production. TC bonders play a pivotal role in HBM production...

Recently, it was reported that to meet the increasing demand for memory chips driven by the artificial intelligence (AI) boom, both Samsung Electronics and Micron set about ramping up their memory chip production capacity. Samsung plans to restart construction of the new Pyeongtaek plant (P5) infras...