As the HBM race heats up, TC (thermal compression) bonders, which stack chips onto processed wafers by employing thermal compression to bond, are in hot demand. Memory giants are scrambling to lock in orders, and according to Money Today, Hanmi Semiconductor is seeing a surge in overseas interest, e...

As the HBM race heats up among memory giants, TC (thermal compression) bonders are taking center stage. Notably, recent developments involving key player Hanmi Semiconductor, Micron, and SK hynix have sparked attention—and could potentially reshape the memory landscape, according to reports from T...

As HBM has emerged as a key battle ground for memory giants amid the surging demand for AI, Micron has created a dedicated business unit for HBM. The company says in its press release that the new structure will be in place by early fiscal Q4, starting May 30, 2025, and financial reporting will foll...

Amid uncertainty over Trump’s new tariffs, memory giants are charging ahead in the HBM3E race. According to South Korean outlets Sedaily and Sisa Journal, Samsung is targeting mass shipments of its 8-layer HBM3E to NVIDIA as early as April, while Micron cleared validation for its 12-layer version ...

Following the notice that a price hike is on the way, U.S. memory giant Micron plans to introduce a new surcharge for U.S. customers starting April 9 to offset costs from Trump’s latest tariffs, as per Reuters. Micron told customers in an email that while some of its products are exempt from ta...