As generative AI applications fuel the era of high computing power, Foxconn's connector subsidiary FIT announced on March 25th a cross-industry collaboration with MediaTek. Together, they will develop next-generation high-speed connectivity solutions, specifically Co-Packaged Optics (CPO), aiming to...

MediaTek has reportedly made its foray into the booming field of Heterogeneous Integration Co-Packaged Optics (CPO), announcing on March 20th a partnership with optical communications firm Ranovus to launch a customized Application-Specific Integrated Circuit (ASIC) design platform for CPO. This pla...

According to TechNews' report, Apple, NVIDIA, AMD, Qualcomm, and MediaTek all utilize TSMC's semiconductor processes for manufacturing their latest chips, with some potentially employing Samsung's foundry, though typically not for flagship products. With Samsung's improved yield rates in recent m...

MediaTek announced a collaboration with Meta to develop its next-generation smart glasses chip. Since Meta has previously used Qualcomm chips for its two generations of smart glasses products, it is speculated that Meta's expansion of chip suppliers is aimed at maintaining supply chain flexibility a...

According to CNA’s news, the potential business opportunities in artificial intelligence have spurred major tech giants, with NVIDIA, AMD, Intel, MediaTek, and Qualcomm sequentially launching products featuring the latest AI capabilities. This AI arms race has expanded its battleground from ser...