On May 30, MediaTek unveiled the Dimensity 7300 series mobile chips, including the Dimensity 7300 and Dimensity 7300X, both utilizing TSMC's highly efficient 4nm process. The Dimensity 7300 offers exceptional energy efficiency and performance, meeting the high demands for multitasking, imaging, gami...

According to Taiwan's Economic Daily News, UMC has recently engaged in discussions with global giants such as Texas Instruments and Infineon about long-term cooperation plans. Additionally, Taiwan’s two leading IC design companies, MediaTek and Realtek, have seen their inventories of WiFi 6/6E chi...

According to a report from Korean media The Korea Economic Daily, Samsung Electronics Co. is planning to apply its 3nm process chips to its Galaxy series smartphones and smartwatches, posing a challenge to rivals Apple and TSMC. The report cited industry sources on May 13th, stating that Samsung'...

Looking at next-generation networks, a range of emerging technologies are playing pivotal roles. From ground-based B5G (Beyond 5G)/6G, Wi-Fi 7, and fixed wireless access (FWA), to non-terrestrial networks (NTNs) like low-orbit satellites, Taiwan-based companies are actively involved in shaping these...

As generative AI applications fuel the era of high computing power, Foxconn's connector subsidiary FIT announced on March 25th a cross-industry collaboration with MediaTek. Together, they will develop next-generation high-speed connectivity solutions, specifically Co-Packaged Optics (CPO), aiming to...