Subject


LEO satellite


2025-05-20

[News] Foxconn Invests €250M in Europe’s First Fan-Out Wafer Level Packaging Plant

According to Economic Daily News, Foxconn announced on May 19 a EUR 250 million investment in Europe. The plan includes forming a joint venture in France with Thales and Radiall to focus on advanced semiconductor packaging and testing (OSAT), along with a strategic partnership with Thales in the sat...

2024-05-11

[COMPUTEX 2024] Next-Generation Smart Network Expands as Strong Demand Drives Rapid Advancements in Related Technologies

Looking at next-generation networks, a range of emerging technologies are playing pivotal roles. From ground-based B5G (Beyond 5G)/6G, Wi-Fi 7, and fixed wireless access (FWA), to non-terrestrial networks (NTNs) like low-orbit satellites, Taiwan-based companies are actively involved in shaping these...

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